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- STMicroelectronics releases dual-inline silicon-carbide power modules with versatile package configurations for EVs
STMicroelectronics releases dual-inline silicon-carbide power modules with versatile package configurations for EVs
STMicroelectronics, a semiconductor manufacturer, has launched the ACEPACK 1DMT-32 family of silicon carbide (SiC) power modules. These modules are presented in a 32-pin, dual-inline, molded, through-hole package designed for automotive applications. The product family is aimed at systems such as on-board chargers (OBC), DC/DC converters, fluid pumps, and air conditioning. The modules offer high power density, a compact design, and simplified assembly. They also provide system designers with a choice of four-pack, six-pack, and totem-pole configurations.
The ACEPACK 1DMT-32 modules contain 1200V SiC power switches that utilize ST’s advanced second- and third-generation SiC MOSFET technology, ensuring low RDS(on) values. These devices offer efficient switching performance with minimal temperature dependence, ensuring high efficiency and reliability at the converter system level.
The modules, built on ST’s robust ACEPACK technology, help to reduce overall system and design development costs while maintaining reliability. The package technology features a high-performance aluminum nitride (AlN) insulated substrate for thermal performance. An integrated NTC sensor is also included for temperature monitoring and thermal protection.
The first product in the ACEPACK DMT-32 series, M1F45M12W2-1LA, has been introduced today with volume production ramping up since Q4’23. Other products in the series, including M1F80M12W2-1LA, M1TP80M12W2-2LA, M1P45M12W2-1LA, M1P80M12W2-1LA, M1P30M12W3-1LA, are currently sampling with volume production set to begin from Q1’24. Pricing is dependent on configuration.
For more information, please visit http://www.st.com/acepack-dmt-32