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Siemens’ new approach for digital twin technology in the electronics supply chain

February 18, 2024

Siemens Digital Industries Software, a provider of software, hardware, and services for digital transformation, has announced a new approach for sharing accurate thermal models of integrated circuit (IC) packages in the electronics supply chain. The Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology, introduced in the latest updates to Simcenter Flotherm software, allows semiconductor companies to generate accurate models for use in high-fidelity 3D thermal analysis without revealing the IC’s internal physical structure.

The technology offers several benefits, including the protection of intellectual property, improved supply chain collaboration, and enhanced accuracy of models for steady state and transient thermal analysis. This innovation is particularly useful in addressing heat dissipation challenges in modern electronics, which are influenced by the miniaturization of semiconductor packages and electronic systems, trends for thin-form consumer products, and demanding processing requirements.

MediaTek Inc., a global fabless semiconductor company, has utilized Simcenter Flotherm to enhance its collaboration with customers. The company has found the Embeddable BCI-ROM technology beneficial for sharing thermal models with customers due to its easy generation, confidentiality, low error rate, and suitability for steady-state and transient applications.

For more information about Siemens’ Embeddable BCI-ROM technology, visit: https://blogs.sw.siemens.com/simcenter/embeddable-bci-rom-cfd-thermal-model/