New half-bridge module for EV chargers from Vincotech (+ Datasheet)

Vincotech, a power module manufacturer, has released their latest product, the flowDUAL E3 SiC. This half-bridge module is designed for maximum power density and can be used to construct high-quality H-bridges and sixpacks. The flowDUAL E3 SiC offers increased current handling, improved power loss dissipation, and greater scalability compared to solutions with a single-module footprint.

When paired with VINcoPress and advanced die-attach technology, this new baseplate-less module is a suitable choice for a variety of high-power applications where efficiency and reliability are paramount. Samples of the flowDUAL E3 SiC are now available through Vincotech’s usual distribution channels.

Basic module information

Part number: B0-EP122PA002ME-PG88F18T

Product line:flowDUAL E3 SiC

Product status: In qualification

Break down voltage:1200 V

Nominal chip current rating:600 A

Standard Packing Quantity:40

Product details

Topology: Half-Bridge

• Kelvin Emitter for improved switching performance

• Temperature sensor

Chip technology (main switch): SiC MOSFET

• High Blocking Voltage with low drain-source on-state resistance

• High-speed SiC-MOSFET technology

• Resistant to Latch-up

Base isolation (e.g. ceramic): Al2O3Electrical interconnection: Press-fit pin

For more detailed technical information, please refer to the product page and check out the datasheet here.

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