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  • Multilayer Ceramic Capacitors: TDK expands MLCC lineup with new state-of-the-art, low-resistance soft termination types

Multilayer Ceramic Capacitors: TDK expands MLCC lineup with new state-of-the-art, low-resistance soft termination types

October 09, 2023

– TDK Corporation has expanded its multilayer ceramic capacitors (MLCCs) series with low-resistance soft termination types, featuring high reliability and large capacitance.– The new MLCCs have unique design where resin layers cover only the board mounting side, reducing electrical resistance, and are available in automotive (AEC-Q200 compliant) and commercial grades.

TDK Corporation has introduced an expansion to its CN series of multilayer ceramic capacitors (MLCCs) with a distinct design and structure. The new design has resin layers only covering the board mounting side rather than the entire terminal electrodes, which allows electric current to bypass the layers and reduces electrical resistance. This unique soft termination product is a first in the industry.

The addition of CNA series (automotive grade) and CNC series (commercial grade) products address market needs for large-value capacitances. The new MLCCs offer up to 22 ㎌ in 3216 size (3.2 × 1.6 × 1.6 ㎜ – L x W x T) and 47 ㎌ in 3225 size (3.2 × 2.5 × 2.5 ㎜ – L x W x T). This means higher capacitances than conventional products, aiding in reducing the number of parts and size.

Soft termination in MLCCs prevents short circuits in power and battery lines. However, it usually has slightly higher terminal electrode resistance. With this new design, resistance is kept low to minimize loss. The automotive grade CNA series comply with AEC-Q200 standards.

Mass production of these products begins in September 2023, following the original release of the CN series in September 2021 due to ongoing demand for higher capacitance.

This expansion of TDK’s MLCC lineup will influence the electric vehicle industry by offering components with larger capacitance, high reliability and low resistance. This can potentially lead to more efficient designs and reduced part count in electric vehicle electronic systems.