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Heraeus Electronics and Robert Bosch GmbH have entered into an agreement for heat sink development

October 16, 2023

• Heraeus Electronics and Robert Bosch GmbH have entered into a patent and know-how license agreement, allowing Heraeus to accelerate development of their inorganic potting compound, CemPack®.

This deal, reached at the PCIM Europe exhibition in Nuremberg, Germany, is to expedite the development of Heraeus’ inorganic potting compound, CemPack®, for encapsulating power modules.

This encapsulation material offers thermal conductivity (>5 W/m/K) and can withstand extreme temperatures (up to 300°C), aiming to improve power density and reliability.

The companies plan to develop encapsulating passive components like magnetics, capacitors, resistors, electric motors (stators), or other devices where a thermal bridge to a heat sink is needed while ensuring environmental protection.

Dr. Klemens Brunner, Head of Heraeus Electronics, stated that “The combination of expertise between Heraeus and Bosch enables a new type of encapsulants that will bring power electronic packages to the next level so that these packages can unfold the full potential of a new generation of semiconductors.”