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DuPont unveils new double-sided metal-clad laminates, designed for flexible and rigid-flex PCBs

April 15, 2024

DuPont has introduced the DuPont Pyralux® ML Series of double-sided metal-clad laminates, designed for flexible and rigid-flex printed circuit boards (PCBs). The new laminates are suitable for high-reliability markets such as aerospace, defense, electric vehicles (EV), artificial intelligence (AI) related networking, and other electronic devices.

Laminates are crucial for complex circuits built on both rigid and flexible substrates, providing mechanical integrity to flex circuits while allowing designers the freedom to fit circuits into the available footprint. The Pyralux® ML double-sided metal-clad laminates are engineered to address thermal management challenges and provide optimized performance. They are suitable for flexible printed circuits, sensors, heaters, and thermocouples deployed in high-reliability applications that can benefit from unique metals with advanced material performance.

DuPont mentioned that, unlike other Pyralux® products, the Pyralux® ML laminate contains metal alloy, such as copper-nickel (CuNi), featuring Kapton® all-polyimide dielectric technology. The alloys provide essential thermal resistance for heating, thermal conductivity to improve the desired heat transfer, resistivity for higher heat output, and thermoelectric properties as needed for the application. Pyralux® ML laminates are available in a variety of dielectric and foil types, thicknesses, and a range of metal constructions. The laminates are fully compatible with most conventional circuit fabrication processes, making them a versatile product-development option for OEMs, designers, and fabricators. Pyralux® ML double-side clads are currently supplied in sheet form and are being strategically rolled out by DuPont Electronics & Industrial.

“At DuPont, we understand the critical role that laminates play in supporting the complex circuits required by our customers. With the launch of Pyralux® ML, we’re proud to add another innovative solution to our extensive family of laminates,” said Thean Ming Tan, global business director, Laminate Products, DuPont Interconnect Solutions.

“Heightened demand for robust thermal-management capabilities was the impetus for DuPont to leverage our engineering expertise in creating this unique laminate material, which is not available elsewhere,” stated Richard Wessel, applications technology manager, DuPont Interconnect Solutions.