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- Aehr Receives Order from New Customer for FOX-NPTM Multi-Wafer Test and Burn-in System for Silicon Carbide MOSFETs – Aehr Test Systems
Aehr Receives Order from New Customer for FOX-NPTM Multi-Wafer Test and Burn-in System for Silicon Carbide MOSFETs – Aehr Test Systems
– Aehr Test Systems has received an initial order for a FOX-NP wafer level test and burn-in system, WaferPak Contactors, and a FOX WaferPak Aligner for silicon carbide devices from a multibillion-dollar US semiconductor supplier.– The FOX-NP system is equipped with the new Bipolar Voltage Channel Module (BVCM) and Very High Voltage Channel Module (VHVCM) options to enhance test and burn-in capabilities for silicon carbide power semiconductors.
Aehr Test Systems, a global semiconductor test and burn-in equipment supplier, announced an initial order from a US-based multibillion-dollar semiconductor supplier for its FOX-NP wafer level test and burn-in system, multiple WaferPak Contactors, and a FOX WaferPak Aligner. These will be used for silicon carbide devices’ engineering, qualification, and small lot production wafer level test and burn-in.
The FOX-NP system, which includes the FOX WaferPak Aligner and initial WaferPaks, is configured with the new Bipolar Voltage Channel Module (BVCM) and Very High Voltage Channel Module (VHVCM) options. These options enable advanced test and burn-in capabilities for silicon carbide power semiconductors using Aehr’s proprietary full wafer Contactors. The order is set to ship by the end of 2023 as per the customer’s accelerated schedule.
Gayn Erickson, President and CEO of Aehr Test Systems, stated, “We are very excited that after conducting a detailed financial evaluation and multiple onsite visits to Aehr’s application lab, this new customer selected our FOX-P solution for engineering, qualification, and production of their silicon carbide power devices. As their production capacity increases, they told us that they will quickly move to our FOX-XP multi-wafer test and burn-in systems for high-volume production.”
The FOX-XP and FOX-NP systems, along with multiple WaferPak Contactors or DiePakTM Carriers configurations, are capable of testing and burn-in/cycling of devices such as silicon carbide and gallium nitride power semiconductors, silicon photonics, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs.
This development signifies Aehr’s growing presence in the silicon carbide global power market. It also suggests a promising future for silicon carbide power devices in electric vehicles, industrial applications, solar power, and other power applications.
This will impact the electric vehicle industry by providing a cost-effective solution for testing and burning-in multiple wafers at once to ensure high device quality. It also expands the silicon carbide test and burn-in market, creating new opportunities for growth in the sector.