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Aehr receives order for FOX-NPTM multi-wafer test and burn-in system from SiC MOSFET manufacturer

April 14, 2024

Aehr Test Systems, a global supplier of semiconductor test and burn-in equipment, has announced an initial customer order for a FOX-NP wafer level test and burn-in system, multiple WaferPak Contactors, and a FOX WaferPak Aligner.

These will be used for engineering, qualification, and small lot production wafer level test and burn-in of silicon carbide devices. The customer is a global semiconductor company with locations across Europe, Asia, and the Americas, serving various industries including automotive, industrial, mobile, and consumer applications. The FOX-NP system, including the FOX WaferPak Aligner and initial WaferPaks, are scheduled to ship over the next few months.

The FOX-NP system is equipped with the new Bipolar Voltage Channel Module (BVCM) and Very High Voltage Channel Module (VHVCM) options. These enable advanced test and burn-in capabilities for silicon carbide power semiconductors using Aehr’s proprietary WaferPak full-wafer Contactors.

The FOX-XP and FOX-NP systems, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, are capable of functional test and burn-in/cycling of devices such as silicon carbide and gallium nitride power semiconductors, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.